
C35 Application Note
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C35 Application Note V1.3
Subject to change without notice
Page
8
RecommendedManualReworkProcedure
Step1:Setupthehotplatetemperatureproperly.DonotputthePCBonthehotplatebeforethe
temperatureisstableatthesetvalue.
Step2:UsetweezerstotaketheC35fromthePCBcarefullyoncethesolderpaste hasmelted.
Step3:Checkthesolderpads
condition.Makesurethesolderpadsarecoveredbythesolderpaste.
Step4:PuttheLEDbacktothePCBproperly.Thetimefromstep2tostep4shouldbecompleted
within30seconds.
Step5:TakethePCBoutofthehotplateandputiton
aheatsinktocooldownthePCBtemperature.
Notes:
1. Avoidsolderballswhichmayshortanode,cathodeorthermalpad,suchasinFigure10.
2. AvoidexternalmechanicalforceappliedontheLEDlensorsubstrate.
3. Donottouchthelenssurfacewithsharpobjectsorfingers.
4. Leakagepathmayexistwhensub‐mountcracks
orchipsduetodamagefromun‐suitablehandling.
5. FinalinspectionandtestissuggestedafterSMTprocessforeachemitter.
Figure10.SolderingProblem
x
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