Sharp IV-C35M Manual de usuario Pagina 10

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C35 Application Note
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C35 Application Note V1.3
Subject to change without notice
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9
ReflowInformation
The LEDs can be soldered using the parameters listed below. As a general guideline, the users are
suggestedtofollowtherecommendedsolderingprofileprovidedbythemanufacturerofthesolderpaste.
Although the recommended soldering conditions are specified in the list, reflow soldering at the lowest
possibletemperatureispreferred
fortheLEDs.
ProfileFeature ForsolderwithPb ForLeadfreesolder
Temprampuprate
(TsmaxtoTp)
3/secondmax. 3/secondmax.
Preheat
- Min.Temp(Tsmin)
- Max.Temp(Tsmax)
- Time(tsmintotsmax)
100
150
60120seconds
150
200
60180seconds
StableCondition:
- Temp.(TL)
- Time(tL)
183
60150seconds
217
60150seconds
PeakTemp.(Tp)
215 260
TimeinPeakTemp.(tp) 1030seconds 2040seconds
Rampdownrate
6/secondmax. 6/secondmax.
Timefrom25 toPeaktemp.
6minutesmax. 8minutesmax.
Notes:Afterreflowprocess,theLEDlenssurfacemaybepollutedbyfluxorcontaminationwhichmay
impacttheLEDopticalperformance.ItissuggestedtocleanthelenssurfacebyalcoholorIPA.Pleaserefer
to“C35LEDCleaning”.
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