
C35 Application Note
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C35 Application Note V1.3
Subject to change without notice
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7
SolderingNotes
a. SolderMethods:C35isdesignedtobesolderedontoaPCB.UserscouldsolderC35s onthePCBbya
reflowovenorahotplate(examplesshowninFigure9)andfollowingthereflowsoldering profilelisted
onthereflowinformation.
DonothandsolderorwavesolderC35LEDs.
HandorwavesolderingcandamagetheC35LED.
Figure9.
b. SolderPasteType
SemiLEDsrecommendsthefollowingsolderpastecompositions:SnAgCu
c. SolderPasteThickness
Asolderstencilprinteroranautomateddispensingsystemisrecommendedforthemostconsistentresults.
SemiLEDsrecommendsusingsolderthicknessrangebetween2~3mil(50‐75μm).
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