Sharp IV-C35M Manual de usuario Pagina 14

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C35 Application Note

©2005-2013 SemiLEDs. All Right Reserved 
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C35 Application Note V1.3
Subject to change without notice

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Thermalmanagement
Figure16.C35LEDLIcurve
Thermalresistance
Figure16showsacrosssectionandasimplethermalmodelforaC35solderedontheMCPCB.Asimple
thermalmodelorthermalcircuitcanillustratetheheatflowingthroughaMCPCB.Heat
releasepathfrom
locationofheatgenerationforLEDchiptoambientisasbelow:
LEDchipDieattachresinceramicMCPCBAmbient
Where:
Tjisthetemperatureatthejunctionofthedevice
TcisthetemperatureattheCeramic
Tbisthetemperatureatthepoint
ofMCPCB
Taistheambientairtemperature
RjcisthethermalresistancefromjunctiontocaseoftheCeramic
RcbisthethermalresistancebetweenthecaseoftheCeramicandtheMCPCB
RbaisthermalresistancebetweenMC PCBandambient
Unitofthermalresistanceis
o
C/W,
Forexample,10Ԩ/Wmeansthattemperaturegoesup10Ԩpereveryinputpower1W.
Equation1belowrepresentstherelationshipbetweenTjandTa.
Tj=Ta+Rba×Pd+Rcb×Pd+Rjc×Pd
=Tb+Rcb×Pd+Rjc×Pd
=Tc+Rjc×Pd
Equation1
Inrealcase,itishardtomeasureTjdirectly,soitwillbeeasiertogettheTjbymeasuringTborTa.Then
theequation1canbesimplifiedtoequation2
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