
C35 Application Note
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C35 Application Note V1.3
Subject to change without notice
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13
Thermalmanagement
Figure16.C35LEDL‐Icurve
Thermalresistance
Figure16showsacross‐sectionandasimplethermalmodelforaC35solderedontheMCPCB.Asimple
thermalmodelorthermalcircuitcanillustratetheheatflowingthroughaMCPCB.Heat
releasepathfrom
locationofheatgenerationforLEDchiptoambientisasbelow:
LEDchipDie‐attachresinceramicMCPCBAmbient
Where:
Tjisthetemperatureatthejunctionofthedevice
TcisthetemperatureattheCeramic
Tbisthetemperatureatthepoint
ofMCPCB
Taistheambientairtemperature
RjcisthethermalresistancefromjunctiontocaseoftheCeramic
RcbisthethermalresistancebetweenthecaseoftheCeramicandtheMCPCB
RbaisthermalresistancebetweenMC PCBandambient
Unitofthermalresistanceis
o
C/W,
Forexample,10Ԩ/Wmeansthattemperaturegoesup10Ԩpereveryinputpower1W.
Equation1belowrepresentstherelationshipbetweenTjandTa.
Tj=Ta+Rba×Pd+Rcb×Pd+Rjc×Pd
=Tb+Rcb×Pd+Rjc×Pd
=Tc+Rjc×Pd
Equation1
Inrealcase,itishardtomeasureTjdirectly,soitwillbeeasiertogettheTjbymeasuringTborTa.Then
theequation1canbesimplifiedtoequation2
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